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However, the application of liquids at the circuit board assembly stage is alien to normal processes and will likely never compete with more efficient alternatives. An emerging alternative is to protect and interconnect individual chips in miniature packages prior to board assembly. The designs use thin coatings and much more efficient metallic interconnection methods rather than heavy encapsulants. Such designs are referred to as chip scale packaging (CSP). Some apply the coating and even the metal interconnections at the silicone wafer level before dicing into individual components.

Englewood Cliffs, NJ: Prentice-Hall, 1970. OLGIERD A. PALUSINSKI University of Arizona Multiconductor Lossy Lines The mathematical model of lossy multiconductor interconnection is defined in the frequency domain and has the following form: dV = −(R + jωL)I; V = V (x, ω) = F {u(x, t)} dx dI = −(G + jωC)V ; I = I(x, ω) = F {i(x, t)} dx where the symbol F ( и ) designates the Fourier transform of the time-domain function, and R, L, G, and C are matrices of resistance, inductance, conductance, and capacitance, respectively.

626. Englewood Cliffs, NJ: Prentice-Hall, 1970. OLGIERD A. PALUSINSKI University of Arizona Multiconductor Lossy Lines The mathematical model of lossy multiconductor interconnection is defined in the frequency domain and has the following form: dV = −(R + jωL)I; V = V (x, ω) = F {u(x, t)} dx dI = −(G + jωC)V ; I = I(x, ω) = F {i(x, t)} dx where the symbol F ( и ) designates the Fourier transform of the time-domain function, and R, L, G, and C are matrices of resistance, inductance, conductance, and capacitance, respectively.

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11.Components, Packaging, and Manufacturing Technology by John G. Webster (Editor)


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